http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1130645-A3

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd221d21998567268ab28734915df324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c07528e5a3d51871502e9eeed697c056
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8319
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2612
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-747
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-00
filingDate 2001-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3379d6dda80f458e61d890e5b8a0fd2
publicationDate 2003-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1130645-A3
titleOfInvention Semiconductor chip with a thermal stress relief layer on the electrodes
abstract A TRIAC which is one species of chip-typensemiconductors includes an element body (10) made ofnsilicon, electrodes (11, 12) provided on one face of thenelement body (10), a molybdenum plate (30) provided onnthe electrode (12) by an alloy plate (1) made of aluminumnand silicon, a molybdenum plate (31) provided on the othernface of the element body (10) by a similar alloy plate (2),nand nickel layers (3, 4) provided on connection faces of thenmolybdenum plates (30, 31) to outer electrode plates (40,n41), so that the electrode (12) and molybdenum plate (30)nare firmly connected without conventional high-temperaturensolder which includes a great amount of lead,nand that the alloy plate (1) never melt even when newlyndeveloped low-temperature institute is employed, and thatnthe operation of the molybdenum plates (30, 31) isnsufficiently realized.
priorityDate 2000-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3665594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4358784-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-3925808-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4734755-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23932
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419405613

Total number of triples: 75.