| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_18d92c46f60af8af24e262b67381d7eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7b94d2715cda37c1f23e48f9f4f23422 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-318513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-311 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
1999-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc2c21b58b70e0b25e04a9db01a1e602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ed4dc34d41be29f584d3e53972acd39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1261c0eaa165a97af9a6e4e3c64f824 |
| publicationDate |
2004-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1121602-B1 |
| titleOfInvention |
Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| abstract |
The present invention improves multi-chip module (MCM) testability by using a new technique to detect on-substrate electric field strength. The invention employs a non-invasive, laser-based instrument to probe the MCM structures fabricated with poled polyimide interlayer dielectrics and thin film metallizations on silicon carriers. Circuit element characteristics of MCMs are probed with laser to detect electric field strength. The electrical, mechanical and optical properties of the electro-optical dielectric layers are determined to investigate the effect of the poling and processing operations on the efficacy of the polyimide as both a dielectric layer and an electro-optic material suitable for laser probing. |
| priorityDate |
1998-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |