patent/EP-1111096-A2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1111096-A2

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
filingDate	2000-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d5061457067611c7ad6007faad75a3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d5f51c916ee7062cccfa7107a408db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9364218ea54f0906e0588c0a81ee5580 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_585e8d18329d0374edb0759df55d2f19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c02d5830e16dae57724258caed2fba43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26ad244b731b3b52040877b6d4aaf658 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbd6ba40b473e33c5ab825de9bc74e23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b96e82003b1604c05f5b940692af0e76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bba4d38a08fabffebde2e55d24c16e07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7e680c7271cae0f7b5c252c58ac7081
publicationDate	2001-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	EP-1111096-A2
titleOfInvention	Seed layer repair method
abstract	Disclosed are methods of repairing metal seed layers prior to subsequent metallization.nSuch repair methods provide metal seed layers disposed on a substrate that are substantially freenof metal oxide and substantially free of discontinuities.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1479793-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0183854-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1199383-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0183854-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007131477-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1199383-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1479793-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6893550-B2
priorityDate	1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1005078-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID136173430 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5460011 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129389030

Total number of triples: 43.