http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1106299-A2

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filingDate 2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a49968764143ea8d08d9cdf503bbc54
publicationDate 2001-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1106299-A2
titleOfInvention Laser etching method and apparatus therefor
abstract The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time not exceeding 1 picosecond, wherein, in laser etching of the work article formed of the inorganic material by irradiation thereof with the laser light from the laser oscillator with a predetermined pattern and with a predetermined energy density, there is utilized means for preventing deposition of a work by-product around the etching position. <IMAGE>
priorityDate 1999-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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