| abstract |
A process for treating a copper or copper alloynsurface (40) of a substrate (10) with a compositionnand corrosion inhibitor solution to minimize defectnformation and surface corrosion, the method includingnapplying a composition including one or more chelatingnagents, a pH adjusting agent to product a pH betweennabout 3 and about 11, and deionized water, and thennapplying a corrosion inhibitor solution. Thencomposition may further comprise a reducing agentnand/or corrosion inhibitor. The method may furtherncomprise applying the corrosion inhibitor solutionnprior to treating the substrate surface with thencomposition. |