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filingDate 2000-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e3c2028a45f52ea676489a6f8f11cfa
publicationDate 2001-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1098363-A2
titleOfInvention Testing integrated circuits
abstract The specification describes a technique for burn-in electrical testingnof IC dies prior to wire bonding the dies to the next interconnection level.nThe dies are provided with a test solder bump array interconnected to thenIC contact pads of the dies. The Known Good Dies (KGD) can then benwire bonded, or alternatively flip-chip solder bump bonded, to the nextninterconnect level.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2380194-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2380194-A4
priorityDate 1999-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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