| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0655 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2000-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9e07352ae26c85a1243dc89ee436b9 |
| publicationDate |
2001-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1097959-A1 |
| titleOfInvention |
High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
| abstract |
A high relative-permittivity B-staged sheetnobtained by incorporating an insulating inorganic fillernhaving a relative permittivity of at least 500 at roomntemperature into a solvent-less resin component so as tonhave an insultaing inorganic filler content of 80 to 99 %nby weight, a high relative-permittivity prepreg obtainednfrom the above high relative-permittivity B-staged sheet, anprocess for the production of the high relative-permittivitynprepreg, and a printed wiring board obtainednfrom any one of the above high relative-permittivity B-stagednsheet and the high relative-permittivity prepreg. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8609558-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6960391-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2327752-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8747730-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03032699-A1 |
| priorityDate |
1999-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |