| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate |
2000-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc4b4b30c7a8db050bef0caab0fb43a9 |
| publicationDate |
2001-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1093327-A2 |
| titleOfInvention |
An improved method to embed passive components |
| abstract |
The invention is directed to a method of embedding thick film passivencomponents on an organic substrate wherein a flexible metallic substrate has anconductive paste underprint applied thereon. The method comprises the followingnsteps: applying a conductor paste underprint onto a flexible metallic substrate;nfiring the preceding article; applying at least one passive component paste onto thenunderprint; firing the preceding article; and applying the passive component sidenof the metallic substrate onto at least one side of an organic layer which is at leastnpartially coated with an adhesive layer wherein the passive component side of thenarticle is embedded into the adhesive layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1355519-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1261241-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1355519-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7688569-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7531416-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1578179-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1578179-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1737283-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004056160-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016007351-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9840651-B2 |
| priorityDate |
1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |