| abstract |
An electronic device (10) and a method for assembling the device (10) comprising a circuit board (14) having contacts (24, 26) and an integrated circuit chip (12) of a given physical geometry, the chip (12) having leads (18, 22) electrically connected in hot-solder relation to the contacts (24, 26) the chip (12) having a protected composition congruent therewith and adhering thereto, the composition comprising a resin (28) having thermostatic crystalline polymer chain portions and thermodynamic polymer chain portions, the thermodynamic chain portions being present in such proportion that they expansively absord the heat of the hot-solder connection in preference to the thermostatic crystalline polymer chain portions. Thus, the protective composition remains comgruent with and adheres to the physical geometry of the chip (12) through a soldering cycle. |