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filingDate 1999-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b11330c4bd6cd756977a7412774834
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publicationDate 2001-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1079005-A1
titleOfInvention Dispersion-strengthened electrolytic cupper foil and method for producing the same
abstract The dispersion strengthened electrolytic copper foilnaccording to the present invention is an electrolytic coppernfoil comprising SnO 2 and Sn, in which copper is present in thenform of fine crystal grains and SnO 2 is dispersed in the formnof ultrafine particles. Such a dispersion strengthenednelectrolytic copper foil has a high tensile strength. n Moreover, the electrolyte used in the method according tonthe present invention can be obtained simply by, for instance,nbubbling an electrolyte containing copper ions, sulfate ionsnand Sn ions by passing an oxygen-containing gas through thenelectrolyte and therefore, it is easy to carry out the methodnof the present invention.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9663868-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9428840-B2
priorityDate 1998-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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