| abstract |
Described herein is a monolithic printhead formed using integrated circuit techniques.nThin film layers (24, 40-50), including ink ejection elements (24, 62), are formed on a topnsurface of a silicon substrate (20). The various layers are etched to provide conductive leads (25)nto the ink ejection elements (24, 62). At least one ink feed hole (26, 66, 67) is formed throughnthe thin film layers for each ink ejection chamber (30). In one embodiment, there are more inknfeed holes (26, 66, 67) than ink ejection chambers (30), so that more than one ink feed holenprovides ink to each ink ejection chamber. A trench (36) is etched in the bottom surface of thensubstrate (20) so that ink (38) can flow into the trench and into each ink ejection chamber (30)nthrough the ink feed holes (26, 66, 67) formed in the thin film layers. An orifice layer (28) isnformed on the top surface of the thin film layers to define the nozzles (34) and ink ejectionnchambers (24, 62). |