| abstract |
The present invention relates to a polyamide resinncomposition comprising:n 100 parts by weight of a polyamide resin mixture comprisingn (A) 20 to 90% by weight of a polyamide 6 resin and/ornpolyamide 66 resin and (B) 10 to 80% by weight of an aromatic polyamide resin; nand (C) 0 to 300 parts by weight of an inorganic filler,n the said aromatic polyamide resin having diamine unitsncomprising 10 to 50 mol% of paraxylylenediamine units and 50nto 90 mol% of methaxylylenediamine units, and aliphaticndicarboxylic acid units, proviso that when the amount of thensaid inorganic filler is not less than 45 parts by weight, thensaid polyamide resin composition further comprises at leastnone component selected from the group consisting of (D) 0.05 to 5 parts by weight of a light stabilizer, (E) 0.05 to 5 parts by weight of a phenolic antioxidant and (F) 0.01 to 5 parts by weight of a copper compound and/or anhalide, based on 100 parts by weight of the polyamide resins (A) andn(B). |