| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_01d154741d5155e492a45ed03f58ee85 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2043-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-32 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-56 |
| filingDate |
1999-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_811860dacf88a14a0bd370a5b7d5283c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d77bfeab39f1ec0c1991a42340d93d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63c0a9b30cf76c3b6d3b0ebb9dd13519 |
| publicationDate |
2005-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1070353-B1 |
| titleOfInvention |
A method for making a wafer-pair having sealed chambers |
| abstract |
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips. |
| priorityDate |
1998-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |