| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
1999-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_414f7829cae4917316fe696e9a28d423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cc8e10b4c43436e4e454edc79d5c6e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8cbac596aa9a1a02a0651afb7b85205 |
| publicationDate |
2001-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1064678-A1 |
| titleOfInvention |
Flux cleaning for flip chip technology using environmentally friendly solvents |
| abstract |
A method of assembling a substrate (200) and die (206) in a flip chip configuration using a non-hazardous cleaning solvent to clean the flux residue (212). The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10 - 10 minutes, temperature 70 - 90 °C, pressure 40 - 70 psi, rotation speed and reversals 100 - 1000 rpm and 24-100 reversal cycles. |
| priorityDate |
1998-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |