| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-20 |
| filingDate |
1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_708d80f4fc343e33aef0b7f14a22fe89 |
| publicationDate |
2000-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1061159-A1 |
| titleOfInvention |
Plating apparatus, plating system, method for plating using the same |
| abstract |
This plating apparatus 4 includes a plating bath 15 filled up with a platingnsolution, a first O ring 17 arranged on a top part of the plating bath 15, fornelectrical connection with an underlying electrode 18 formed on a wafer 2, ansecond O ring 20 arranged on the top part of the plating bath 15 so as to preventnthe plating solution in the plating bath 15 from contact with the first O ring 17, annanode plate 24 disposed in the plating bath 15 and an ultrasonic oscillatingnelement 26 arranged in the plating bath 15. The plating apparatus 4 is capablenof forming a plating film having an uniform thickness on the semiconductornwafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1099781-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6573183-B2 |
| priorityDate |
1998-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |