| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1998-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a9596cf61231ca14c0c6369c74ddcc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adb3dc4475541ca7fb9581966e19b5b1 |
| publicationDate |
2007-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1043922-B1 |
| titleOfInvention |
Multilayer printed wiring board |
| abstract |
A multilayer printed wiring board having a field via structure and having an excellent connection reliability between via holes. A lower-layer via hole (50) having a flat surface is formed by filling up an opening (42) provided in a lower interlayer resin insulating layer (40) with a plating metal (48), and an upper-layer via hole (70) is formed by providing an opening (62) in an upper interlayer resin insulating layer (60) of the via hole (50). Since the lower-layer via hole (50) has a flat surface and no resin is left on the surface, the connection reliability between the via hole (50) and the upper-layer via hole (70) is secured. In addition, since the surface of the via hole (50) is flat, the surface smoothness of the multilayer printed wiring board is not marred even when the upper-layer via hole (70) is formed on the via hole (50). |
| priorityDate |
1997-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |