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filingDate 1998-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e8acecaec236fbd94ae71d0248677a2
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publicationDate 2003-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1030780-B1
titleOfInvention System and method for curing a resin disposed between a top and bottom substrate with thermal management
abstract A system and method cure a combination of a top (6) and a bottom (6) substrate with a resin (8) disposed in-between. A cure platform (1500) includes a chuck on which the combination rests. A cure device (1700) cures the resin. An actuation assembly (1560) separates the chuck (1530) from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.
priorityDate 1997-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 49.