| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac93f643b44e958763fd1234fe359e3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 |
| filingDate |
1998-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_713d99cfdff084619eb3cb43137cc977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5373e8bee68e88a5cb5b49c916caf6a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2597c8628b86dbdf3e089a456f20e6dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6fd217c91d82fc373d02663b8150610
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_047d2f38fed2de946b136f464acc8ddf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bb9f691eeb416e846db8713f355d068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc251c849122ef4be69507c5000aade9 |
| publicationDate |
2002-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1023821-B1 |
| titleOfInvention |
Method for connecting surface mount components to a substrate |
| abstract |
There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations arranged such that each termination rests atop a respective mounting pad; (2) preheating the assembly from a first temperature T1 to a second temperature T2 below the melting point TM of the solder paste; (3) soaking the assembly at substantially the second temperature T2; (4) selectively heating each solder paste deposition to a third temperature T3 above the melting point of the solder paste depositions while maintaining the substrate at substantially the second temperature T2; and (5) cooling the assembly to a fourth temperature T4 below the second temperature T2. |
| priorityDate |
1997-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |