| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 |
| filingDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c23db9b970893d6f186f6878ca7b3866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4569f0975a3e629289808db3581a58c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db9354f60e5effd93f2783c0350f7d5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_897fb58a380a83e57d44e8b06c1ce932
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a5d2bb8b4ea7891085b042d00bdbf74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39fdd76ff3b20f9fa611362fe186be8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fde8670e501a6152f43783fb5bcf79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_197f4d5a28d84af1fdf07b74c2f0e591
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5500d5a415bd89ac0d9ea1077795957 |
| publicationDate |
2000-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1011107-A1 |
| titleOfInvention |
Insulated wire |
| abstract |
An insulated wire having excellent fabricability causing no cracking in thenfilm even after severe winding or rolling fabrication and also having heat resistancencomparable to that of polyamideimide is disclosed, in which a first insulation layernof a thermosetting resin composition having a Tg of 250°C or higher is formed on anconductor, on which a second insulation layer formed of a mixture of anthermosetting resin composition having a Tg of 250°C or higher and anthermoplastic resin composition having a Tg of 140°C or higher is formed, and innwhich the adhesion of the insulation film to the conductor is 30 g/mm or more, andnthe elongation at break of the insulation film is 40% or more, with the mixing rationof the thermoplastic resin in the second insulation layer being from 30 to 70% bynweight and the ratio T 1 /T 2 of the thickness T 1 of the first insulation layer to thenthickness T 2 of the second insulation layer being within a range of 5/95 to 40/60,nand a residual amount of the solvent in an insulation film is 0.05% by weight or lessnof the total amount of the insulation film in a preferred embodiment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102844822-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2568476-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2555204-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2555204-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2579275-A4 |
| priorityDate |
1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |