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filingDate 1999-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13bb0fcf26969eb2780b8586e7cf7783
publicationDate 2000-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0999253-A1
titleOfInvention Adhesive and circuit material using the adhesive
abstract When an adhesive is applied on a metallic wiring, the metal forming the metallic wiring film dissolutes as ions into the adhesive with time. If the adhesive is based on a polyester resin and placed in an environment of high temperature or high temperature and high humidity, adhesion and insulation are deteriorated by the free metallic ions. However, adhesives of the present invention contain a cation scavenger to scavenge the free metallic ions in the adhesives. Thus, highly durable flat cables can be obtained. Thus, flat cables with reduced loss in adhesive strength and insulation are provided.
priorityDate 1998-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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