Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48022e6a70641230cd5f87ec7aabc491 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2933 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0769 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2938 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2958 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00 |
filingDate |
1999-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13bb0fcf26969eb2780b8586e7cf7783 |
publicationDate |
2000-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0999253-A1 |
titleOfInvention |
Adhesive and circuit material using the adhesive |
abstract |
When an adhesive is applied on a metallic wiring, the metal forming the metallic wiring film dissolutes as ions into the adhesive with time. If the adhesive is based on a polyester resin and placed in an environment of high temperature or high temperature and high humidity, adhesion and insulation are deteriorated by the free metallic ions. However, adhesives of the present invention contain a cation scavenger to scavenge the free metallic ions in the adhesives. Thus, highly durable flat cables can be obtained. Thus, flat cables with reduced loss in adhesive strength and insulation are provided. |
priorityDate |
1998-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |