| abstract |
A thermosetting pressure-sensitive adhesive which cannobtain the high rate of polymerization without a decrease in thenmolecular weight by photopolymerization, thereby show thentackiness at ordinary temperatures to permit easy temporarynadhesion to an adherend, can be cured by heating for a short periodnof time to exhibit strong adhesive strength and high heatnresistance, and is excellent in storage stability before heating,ncomprising a photopolymerized product of a composition comprisingna) 100 parts by weight of a monomer mixture comprising 70% to 99%nby weight of an alkyl (meth)acrylate whose alkyl group has 2 ton14 carbon atoms on average, and 1% to 30% by weight of anmonoethylenic unsaturated acid copolymerizable therewith basednon the monomer mixture, b) 0.01 part to 20 parts by weight of ancleavage type photopolymerization initiator having 3 or morenperoxide groups in its one molecule, c) 5 parts to 30 parts bynweight of an epoxy resin, and not substantially containing a curingnagent for the epoxy resin as ingredient (c). |