| abstract |
Disclosed are an adhesive composition for a metal foilnwhich comprises a material wherein a tracking resistancentest is carried out according to the IEC method by makingna thickness of an adhesive layer 30 to 40µm, using ancopper foil pattern with a width of 4mm and making andistance between electrodes 0.4mm, then the adhesivenlayer dissolves out for the first time when 5 drops ornmore of an electrolyte are dropped thereon, wherein the adhesivencomposition preferably comprises a polyvinyl acetal and anpolyfunctional acrylate compound; an adhesive-coated metal foil,na metal-clad laminate, a wiring board, a multi-layer boardnand a multi-layer wiring board using the same. |