| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1de11c7166fa54667fede6edc498ec30 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1168 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
1998-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fbeb09bdee353821caa185313aa928c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_043cd070c225836020d230666b8b2649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7906ee265091265c8f60ff9174aa1e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38d133f6ff4c0137b06a8e2a8aed0de9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d1c4ab53120a75e989f652a7db0bde1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b2c9d2f8a9f651ac62f70cf7902f7f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64b4bb6e13bc24c5147508f447c93951 |
| publicationDate |
2007-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0985333-B1 |
| titleOfInvention |
Process for modification of surfaces |
| abstract |
In using a photoinitiator and irradiation with UV-light suitable monomers can be selectively inoculated on the surface of a non conducting substrate in a distinct pattern. Metal ions are thereafter absorbed by these monomers and are reduced. To this pattern further conducting materials, e.g., metals, can thereafter be added in a conventional way. The method according to the invention comprises a fully additive method to produce a circuit board with high resolution and the production of functional components directly on a non conducting substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110536872-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1768473-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1768473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3354629-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018141741-A1 |
| priorityDate |
1997-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |