http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0972814-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7afdc141b49867c94ccb4bb44e493a91 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-02 |
| filingDate | 1999-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86ed377a97969e2d1f80e120dc001d25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f1f5d9f380531834f19d05af04b3e68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_201a751f7c7f6fb6811cbe593a6537df |
| publicationDate | 2000-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0972814-A1 |
| titleOfInvention | Low-melting copolyester- or copolyetherester melt adhesives |
| abstract | The invention relates to new fast-crystallizing hotmelt adhesives with a melting point between 65 ° C to 95 ° C. They consist of a randomly structured copolyester or copolyetherester based on terephthalic acid, adipic acid and a mixture of aliphatic diols, the molar proportion of terephthalic acid, based on the total amount of acid, being between 55 and 85 mol% and the molar proportion of adipic acid between 15 and 40 mol% is that a combination of butanediol and hexanediol is present as the diol component, the molar proportion of butanediol being between 40 and 55 mol% and the molar proportion of hexanediol being between 40 and 60 mol%. To increase flexibility, a dimer acid with a molecular weight between 400 and 800 g / mol up to 15 mol% or a higher molecular weight polyethylene glycol with a molecular weight between 600-4000 g / mol up to 10 mol% can be used. The melting point of the copolyester or copolyetherester melt compositions is between 65 ° C and 95 ° C. The copolyester or copolyetherester hotmelt adhesives according to the invention can be used in the hotmelt process and for the known other powdery coating processes. |
| priorityDate | 1998-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.