| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5202091df9de019fc995f2d266f9ecc2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
1999-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_809218dae84d8a73e0a12fba85bb5bd0 |
| publicationDate |
1999-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0966030-A1 |
| titleOfInvention |
Feedthrough interconnection assembly |
| abstract |
A conductive feedthrough (10) for providing electrical current to semiconductornpackages. A conductive wall (110) portion of a semiconductor package contains anninsulating material (120) disposed in an aperture in the conductive wall (110). The insulatingnmaterial (120) has an axial bore (164) into which an electrical conductor (135) is inserted.nThe conductor (135) has a reduced diameter in the portion inside the axial bore (164) andnenlarged portions on either side of the axial bore (164). |
| priorityDate |
1998-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |