| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0969
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
| filingDate |
1999-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e542ef5793267873b4dae4e78404d224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd4611456f1baab9e1f971fe64f294a |
| publicationDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0964610-A2 |
| titleOfInvention |
Printed wiring board and process for forming it |
| abstract |
Disclosed are a printed wiring board havingnmicro-via holes highly reliable for conduction and a methodnof making the micro-via hole by providing a coating ornsheet of an organic substance containing 3 to 97 % bynvolume of at least one selected from a metal compoundnpowder, a carbon powder or a metal powder having a meltingnpoint of at least 900°C and a bond energy of at least 300nkJ/mol on a copper foil as an outermost layer of a copper-cladnlaminate having at least two copper layers, ornproviding a coating or sheet of the same after oxidizing ancopper foil as an outermost layer, irradiating the coatingnor sheet with a carbon dioxide gas laser at an output of 20nto 60 mJ/pulse, thereby removing a micro-via-hole-formingnportion of at least the copper foil as the outermost layer,nthen irradiating micro-via-hole-forming portions of thenremaining layers with a carbon dioxide gas laser at annoutput of 5 to 35 mJ/pulse to make a micro-via hole whichndoes not penetrate through the copper foil in a bottom ofnthe micro-via hole, and electrically connecting the coppernfoil as the outermost layer and the copper foil in thenbottom of the micro-via hole with a metal plating or annelectrically conductive coating composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6989329-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7151228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1289354-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106163120-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1196016-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1196016-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6831009-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104684263-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104684263-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-02062116-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1283662-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1283662-A4 |
| priorityDate |
1998-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |