| abstract |
There is disclosed herein a method for laser soldering,ncomprising the steps of: (a) providing an electronicncomponent 10 having at least two terminations 12 thereon; andielectric substrate 14 having a first surface 16 on a firstnside 18 thereof, a second surface 20 on a second side 22nthereof, and at least two mounting pads 24 arranged on thenfirst surface 16 in matched relation with the terminationsn12 of the electronic component 10; and a diode laser 50; (b)ndepositing solder paste 26 atop the mounting pads 24; (c)nplacing the electronic component 10 atop the substrate 14nsuch that each termination 12 rests generally atop itsnrespective mounting pad 24; and (d) directing laser energyn70 from the diode laser 50 to at least one of the mountingnpads 24 from the second side 22 of the substrate 14 for anpredetermined time, such that the solder paste 26 atop thenat least one of the mounting pads 24 is melted. |