http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0953400-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38e72bf35b2c9cf15b388d0378b79abd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 |
| filingDate | 1999-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a6e86e8f2cd0e7edf053ac964c812c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0eb1715f5200045d60e39341da1c37ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98ec29a998d69855e7ca6ed5b90242de |
| publicationDate | 1999-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0953400-A1 |
| titleOfInvention | Fatigue-resistant lead-free alloy |
| abstract | A lead-free solder alloy suitable for forming solder joints of ansurface-mount integrated circuit device, such as a flip chip. The solder alloynhas a sufficiently low liquidus temperature to achieve desirable reflownproperties at temperatures of 240°C and less, and is therefore compatible withnintegrated circuit processes. The solder alloy has a sufficiently high solidusntemperature to ensure that solder joints formed with the alloy exhibit suitablenmechanical properties at application temperatures up to 150°C when mountingna component to a laminate substrate. The solder alloy generally contains, innweight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver,nand about 0.5 to about 1.5% copper, the balance tin and incidental impurities. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-98429-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1196015-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1196015-A1 |
| priorityDate | 1998-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.