| abstract |
The invention relates to a vacuum plasma coating systemnconsisting of a horizontal vacuum chamber (1),na substrate holder (6) arranged therein, by means ofnof the substrates (5) during the coating by at leastnrotate a horizontal axis (4), at least onenVacuum arc evaporator (12, 14) and at least onenarranged within the rotation circle of the substrates (5)nthermal evaporator (10).n n n Furthermore, the invention relates to the use of the vacuum plasma coating system, wherein for the deposition several layers on the substrate, the materials which can advantageously be thermally evaporated are evaporated from the thermal evaporator (10) and which are thermally not or only difficult to evaporate Materials are evaporated from the vacuum arc evaporator (12, 14). |