| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1af8df51ce24ca931ae718fb747f6aa0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
1999-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e8cf240a1f1048dd0c2d4fd504d2c79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_172dfa61e84e83e4dcf61f3d7177a3ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c2d54a9916a3be6e2c1c7b8f27fe5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8f0c218a367547d269835f95c3eb865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_507abcd068b5dba8bf4204ebb6ae7e12 |
| publicationDate |
2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0939441-A3 |
| titleOfInvention |
Encapsulant resin member for semiconductor, and semiconductor element |
| abstract |
Provided is an encapsulant resin for ansemiconductor that effectively functions even with anrelatively small amount of an additive. n The encapsulant resin for a semiconductor isncharacterized in that the additive has a concentrationngradient in the direction of thickness of thenencapsulant resin. Specifically, the concentrationngradient of the additive is established in thendirection of thickness of the encapsulant resin bynstacking at least two types of organic polymer resinsncontaining different contents of the additive to formnthe encapsulant resin or by applying an electric fieldnto the encapsulant resin to effect electrophoresis ofnthe polar additive in the encapsulant resin. |
| priorityDate |
1998-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |