| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8292741de96a44319670508be1f78f1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_481648b910607c5dcbe4ba1c7a2b84a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
1998-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3b17370aae19251e127a6337781c090
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_553ae3f3e9929cfc4ca0dcf112d309d8 |
| publicationDate |
2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0933812-B1 |
| titleOfInvention |
Electroplating of conducting elements in integrated circuits |
| priorityDate |
1997-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |