| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51ef6a7abcafffad58c7251432ded821 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D15-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D15-00 |
| filingDate |
1997-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4ebddc459483818fe04cba82a0fb97b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aec5683d6b4cb7256bfec374f94f819c |
| publicationDate |
1999-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0914691-A1 |
| titleOfInvention |
Low friction, ductile, multilayer electrodeposits |
| abstract |
The present invention relates to composite articles including a surface layer (4) of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of friction and low insertion force and fretting corrosion in separable electronic connectors, and to methods for preparing the plated articles. The polymeric particles have a size between about 0.1 to 0.45 ν in diameter to reduce the coefficient of friction of the resultant deposit to about 0.45 or below. Also, the deposit has excellent electrical properties and can be successfully soldered. The invention also relates to a solution for plating the surface layer (4) of the composite articles, which surface layer (4) reduces insertion force and fretting corrosion of separable electronic connectors. |
| priorityDate |
1996-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |