Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77a1f5fc0c4376a957e9fc040fb142bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af99df08b153738cd418446a75d09bfc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S206-813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F210-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D5-00 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F210-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B31B50-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08 |
filingDate |
1997-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2623d5c6a8ab982f7f24ac22610f327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1ef66fecf2f20ab92a1894b8df79946 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbd17cc0edfa47fc18995b6fe87ca952 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dd643c711b5e9f54375c2a91266cd9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc2948229412198ef2dba4ef3547199 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ee98c4da47f0e052e9db4ce7291091a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cea728f698c12f543f0aec6978d07c35 |
publicationDate |
1999-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0912646-A1 |
titleOfInvention |
Hot melt adhesives |
abstract |
Disclosed are hot melt adhesives comprising at least one first homogeneous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350°F (177 °C), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20α-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150 °C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8163833-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008045802-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008063723-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102011086845-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013076175-A1 |
priorityDate |
1996-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |