| abstract |
A thermal conductive sheet 31 including at least 70-95 weight parts ofninorganic filler and 5-30 weight parts of thermosetting resin composition andnhaving flexibility in an uncured state is prepared. Through-holes 33 arenformed in the thermal conductive sheet 31 and a conductive resinncomposition 34 is filled in the through-holes 33. The thermal conductivensheet 31 and a semiconductor chip 35 are overlapped to match positions ofnthe through-holes 33 formed in the thermal conductive sheet 31 with those ofnthe electrodes formed on the semiconductor chip 35. The thermalnconductive sheet 31 and the semiconductor chip 35 are compressed whilenbeing heated and the thermal conductive sheet 31 is cured and integratednwith the semiconductor chip 35. An external lead electrode 36 is formed onnthe thermal conductive sheet 31 at a side opposite to the surface where thensemiconductor chip 35 is overlapped, and that is connected with thenconductive resin composition 34. According to the above-mentionednconfiguration, a semiconductor package that is not required to be sealed bynresin, and is excellent in reliability, air-tightness and thermal conductivityncan be realized. |