| abstract |
A microetching agent for copper or copper alloyncomprising an aqueous solution of 1-50% by weight of sulfuricnacid, 0.1-20% by weight of hydrogen peroxide, and 0.0001 -3%nby weight of at least one of tetrazole or tetrazolenderivatives. The composition can roughen surfaces of coppernor copper alloys into those possessing deep irregularitiesnthat exhibit excellent adhesion to resins such as resists,nand superior solderability. |