Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09781 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09918 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0643 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0665 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0648 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4679 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
1997-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2007-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_714d62ce42690127f6a3d4eb7388a833 |
publicationDate |
2007-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0884128-B1 |
titleOfInvention |
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
abstract |
A laser machining apparatus by which via-holes which have very small diameters can be formed at a low cost. The wavelength of a laser beam emitted from a CO2 laser oscillator (60) is shortened by a tellurium crystal (94) to suppress the diffraction of the laser beam and reduce the value of the focusing limit when the laser beam is focused. Thus, the spot diameter of the laser beam is reduced and holes for the via-holes can be formed in an interlayer insulating resin film on a board (10). Since the diameters of the holes are not increased even if the power of the laser beam is increased to form deeper holes, the holes for via-holes having very small diameters can be formed. An apparatus and method for manufacturing a multilayer printed wiring board is also disclosed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8293579-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8959756-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9245838-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8067699-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8822323-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8524535-B2 |
priorityDate |
1996-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |