http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0859953-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b57a2ca92b40eec75abed0b30db453f7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N23-083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N23-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N23-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-304 |
| filingDate | 1996-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3eb6dae060afad3ad23eaf795adcf48c |
| publicationDate | 2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0859953-B1 |
| titleOfInvention | Process and arrangement for testing solder joints |
| abstract | The invention concerns a process and circuit arrangement for testing solder joints, preferably on printed circuit boards, whereby the quality of the solder joints is examined for defects using X-rays and qualitative information on the individual solder joints is obtained. According to the invention, the qualitative and/or the measured values of the individual solder joints that characterize the measured physical parameters of the tested solder joints, are used to control the manufacture of further solder joints in the production process in which solder joints are tested. |
| priorityDate | 1995-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.