| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0759
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1996-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2194036be68d626e70d8f5754feb041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a7c71b09cbffc8f5c3fb161c25c0f41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17e4f02bc79bf1b8f3df0f0212cd44c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a60ab6107ebd0e18c85adc0a23afaa6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2aea5fc345c4511e1e7e6075ae0026e |
| publicationDate |
1998-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0858725-A1 |
| titleOfInvention |
Multilayer printed circuit board and process for producing the same |
| abstract |
A multilayer printed circuit board, characterized by being composed of an internal layer circuit board (1) coated with a light and heat curable undercoating agent (3), a copper foil (5) and an insulating adhesive (4) comprising as the main component a brominated bisphenol type epoxy resin or brominated phenoxy resin having a weight average molecular weight of at least 10,000, the copper foil (5) and the insulating adhesive (4) being laminated to one side or both sides of the internal layer circuit board (1) and being integrally cured with the internal layer circuit board (1) and the undercoating agent (3). |
| priorityDate |
1995-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |