| abstract |
Cards which contain any one of the following thermoplasticnresin compositions I to III in its material can be used asnmagnetic cards, IC cards, etc. since they are excellent innheat resistance, processability and embossability:n I. A composition consisting of the following ingredients (A)nand (B) II. A composition consisting of the following ingredients (A),n(B) and (D) III. A composition consisting of 100 parts by weight of one ornmore selected from the following ingredients (A), (B) and (D)nand 2 to 25 parts by weight of the following ingredient (C) n(In the above I to III,n the ingredient A is a polyester composed of dicarboxylic acidncomponents with terephthalic acid component as a mainndicarboxylic acid component and ethylene glycol component (I) nand 1,4-cyclohexanedimethanol component (II) as main glycolncomponents, with the molar ratio (I)/(II) of ethylene glycolncomponent (I) to 1,4-cyclohexanedimethanol component (II) keptnat 1 or more; the ingredient B is an aromatic polycarbonate; the ingredient C is an inorganic sheet-like filler of 0.5 ton20 µm in average grain size; and the ingredient (D) is a polyester composed of dicarboxylicnacid components with terephthalic acid component as a mainndicarboxylic acid component and ethylene glycol component (I)nand 1,4-cyclohexanedimethanol component (II) as main glycolncomponents, with the molar ratio (I)/(II) of ethylene glycolncomponent (I) to 1,4-cyclohexanedimethanol component (II) keptnat smaller than 1.) |