| abstract |
A semiconductor light emitting device includes ansemiconductor light emitting element (1), a resin stem (10)nhaving a recess (7), and a projection (9) made of a light-transmissiventhermosetting resin on the resin stem so asnto cover the entire upper surface and continuous upper partnof side surfaces of the resin stem to a predeterminedndepth. The recess is filled with a light-transmissivenresin encapsulating element (5) to embed the semiconductornlight emitting element, one end of an externally extendednfirst lead (21) and one end of an externally extendednsecond lead (22) electrically connected to first and secondnelectrodes of the semiconductor light emitting element, andna bonding wires (4) connecting the second lead to thensecond electrode. The projection functions as a lens andnis made by hardening a fluid-state resin in an encapsulatingncase mold. Since the projection extends over the uppernsurface and upper part of side surfaces continuous from thenupper surface, it is firmly bonded to the resin stem withna high adherability. |