| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D17-049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
1997-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_892e7ce74e107e04cda7deb5db9f1caf |
| publicationDate |
1998-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0847843-A1 |
| titleOfInvention |
Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same |
| abstract |
A cleaning composition for a mold for molding ansemiconductor device comprising an unvulcanized rubber, ancleaning agent, and water in an amount of from 1 to 30% bynweight based on the total amount of the cleaning composition. n The cleaning composition is preferably used as a sheetnform comprising the cleaning composition itself, wherein anplurality of straight cuts are formed on the surface of thensheet in a definite direction in parallel at an definiteninterval for enabling folding of the sheet and at least onencutting cut may be formed on the surface such that the cuttingncut crosses perpendicularly to the plural cuts. n The cleaning sheet is very effective to remove soilednmaterial on the inside surfaces of a mold formed by repeatedlynmolding semiconductor devices using a thermosetting resinncomposition. |
| priorityDate |
1996-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |