| abstract |
An epoxy resin composition for printed wiring boardsnwhich comprises as the essential components (a) an epoxynresin obtained by epoxidizing a condensation product of anphenol with hydroxybenzaldehyde, (b) a condensation productnof bisphenol A with formaldehyde, (c) a flame retardant, andn(d) a curing accelerator, and a laminate for printed wiringnboards which has a low hygroscopicity, a high heatnresistance, good high-temperature characteristics, a highnresistance against electrolytic corrosion, a high resistancenagainst color change due to heating, and a high Tg. |