| abstract |
A multilayer wiring board for mounting a semiconductorndevice, which has a multi-bonding-deck cavity (3), comprises atnleast two wiring boards (2,2') and an insulation adhesive layer (1)nhaving an elastic modulus of 1,400 MPa or lower having ancoefficient of thermal expansion of 450ppm/°C or lower in andirection of thickness and being a cured product of annadhesive film which is a semi-cured product of an adhesivencomposition comprising (a) 71 to 100 parts by weight of annepoxy group-containing acrylic rubber having a glassntransition point of -10°C or above and a weight averagenmolecular weight of 100,000 or above, (b) 50 to 70 parts bynweight of an epoxy resin having a weight average molecularnweight of less than 10,000 and a curing agent, (c) 10 to 60nparts by weight of a high-molecular weight resin beingncompatible with the epoxy resin and having a weight averagenmolecular weight of 30,000 or above and (d) 0.1 to 5 parts bynweight of a cure accelerator. |