| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e83d93ed02bbd6159e99b5a7796e3686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_385752f237551ca1b257f160a0f2434b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e575313749eb12da4c0ecb6f34013941 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
1997-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3618e1f32a88c8371fdcd5aa29036fe9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74f105e232460b3eb4defbb21e8aa200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_009438e975ded0770594d02b97fae71d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ad9a9d6e60930e912cbfc02677c14ce |
| publicationDate |
1999-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0831373-A3 |
| titleOfInvention |
Photo-curable resin compositions and process for preparing a resin-based mold |
| abstract |
A photo-curable resin composition suitable asna material for photo-fabricating. The composition cannproduce cured products with excellent mechanicalnstrength and high heat resistance. Further disclosed isna process for fabricating a resin-based mold whichnprovides superior molding dimensional precision andnsuperb repetition durability. The composition comprisesn(A) a compound having a cyclohexene oxide structure,n(B) a cationic photo-initiator, (C) an ethylenicallynunsaturated polymer, (D) a radical photo-initiator, andn(E) spherical silica particles, and the heat distortionntemperature of the cured resin produced from the photo-curablenresin composition is 100°C or higher. Thenprocess comprises preparing a resin-based moldncomprising a plurality of integrally laminated layersnof cured resin by repeating the step of forming a curednresin layer by selectively irradiating a photo-curablenmaterial with light, wherein the photo-curable materialnis the above-mentioned photo-curable resin composition. |
| priorityDate |
1996-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |