http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0827159-A3
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 |
| filingDate | 1997-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1998-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0827159-A3 |
| titleOfInvention | Epoxy resin composition and semiconductor device encupsulated therewith |
| abstract | In an epoxy resin composition comprising an epoxynresin, a curing agent, and 80-90 wt% of a particulateninorganic filler, fine particles having a particle size ofnless than 3 µm account for 10-40 wt% of the inorganicnfiller, and the inorganic filler has a specific surface areanof less than 2.5 m 2 /g as measured by a nitrogen adsorptionnBET method. The inorganic filler satisfies that when anblend of a bisphenol F type liquid epoxy resin having anviscosity of 30-45 poises at 25°C as measured by Gardner-Holdtnmethod with 75 wt% of the inorganic filler is measurednfor viscosity at 25°C by means of an E type viscometer, thenviscosity at a shear rate of 0.6 s -1 is less than 50,000npoises and the ratio of the viscosity at a shear rate of 0.6ns -1 to the viscosity at a share rate of 10 s -1 is less thann2.5/1. The epoxy resin composition has a low melt viscositynenough to mold on semiconductor devices without die pad andnwire deformation. |
| priorityDate | 1996-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.