| abstract |
The present invention is directed to a semiconductorndevice comprising : a first semiconductor device (31) having anfirst protruding contact (37) ; and at least one of a circuitnboard and a second semiconductor device (31) having a secondnprotruding contact (37) whose hardness is lower than thenhardness of said first protruding contact (37), wherein atnleast a part of said first protruding contact (37) is embeddednin said second protruding contact (37). The semiconductorndevice further comprises an electrically insulating resin (39)ndisposed between said first semiconductor device and saidncircuit board or second semiconductor device (31). |