patent/EP-0821406-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0821406-B1

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G08B13-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077
filingDate	1997-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2007-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df10ff15d0d317659b812e760844bffc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1910492f410cdeb7a0f14dfdb6055780 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5430002edb54af676823450719e45251
publicationDate	2007-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	EP-0821406-B1
titleOfInvention	An integrated circuit on an ultra-flexible substrate and a method of wire bonding an integrated circuit to an ultra-flexible substrate
abstract	A method of electrically connecting an integrated circuit (IC (14)) to at least one electrical conductor on a flexible dielectric substrate (26) having an IC attachment area (36) and at least one resonant circuit formed thereon. The resonant circuit is formed with two conductive patterns disposed on two opposite principal surfaces of the flexible substrate (26). The conductive patterns are electrically connected to each other to form an inductor (22) and a capacitor, with the inductor (22) also functioning as an antenna. The IC attachment area (36) of the flexible substrate (26) is cleaned and the latter is secured in a fixed position in a plenum to prevent substantial movement thereof. The IC (14) is secured to the IC attachment area (36). Wire bonding of the IC (14) to at least one electrical conductor (38, 40, 42) of the resonant circuit is performed. A protective covering is applied over the IC (14) and the wire bond to protect the wire bond from being damaged by external forces. <IMAGE>
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8749390-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106575369-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106575369-B
priorityDate	1996-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 69.