| abstract |
The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of formula (I) in which R?1 and R2¿, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O. |