| abstract |
An adhesive comprising (1) 100 parts by weight of ancombination of an epoxy resin having a weight averagenmolecular weight of less than 5,000 and a curing agent, (2)n10 to 40 parts by weight of a high-molecular weight componentnbeing compatible with the epoxy resin and having a weightnaverage molecular weight of 30,000 or above, (3) 20 to 100nparts by weight of a high-molecular weight component beingnincompatible with the epoxy resin and having a weight averagenmolecular weight of 30,000 or above, and (4) 0.1 to 5 partsnby weight of a cure accelerator. The adhesive is excellentnnot only in moisture resistance, heat resistance, adhesivenstrength at high temperature, heat dissipation, reliabilitynof insulation, crack resistance and flexibility but also inncircuit filling and tight adhesion, and exhibits suitablenflow properties. |