| abstract |
The invention relates to compounds containing A) a hardener component consisting of hydroxyl- and uretdione group-containing polyadducts, B) a binder component consisting of 1,2-epoxy compounds with more than one 1,2-epoxy group and one or more hydroxyl groups in the molecule, optionally, C) further compounds containing hydroxyl groups and, if appropriate, D) auxiliaries and additives known from adhesive technology. The invention further relates to a process for the preparation of these compounds and their use as thermosetting, one-component, split-off and solvent-free and temperature and solvent-resistant polyurethane (PUR) adhesives. |